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Al2O3 ceramic substrate/plate

Al2O3 ceramic substrate/plate

Click here for:  Sapphire(Al2O3) single crystal substrate

Substrate material

Alumina ceramic plate/substrate


Al2O3  96% and 99.6%

Density (g/cm3)


Thermal conductivity (w/m.k)


Thermal expansion (x10 -6 / ℃)


Dielectric Strength (Kv/mm)


Dielectric Constant (at 1MHZ)


Loss tangent (x10 -4 @1MHZ)


Flexural strength (N/mm2 )


Volume resistivity (ohm-m)

>1014  at 20℃

Standard Size

140 x 190 x 1.0mm
100 x 100 x 1.0mm
80 x 80 x 1.0mm
2" x 2" x 0.5mm
3"x3"x 0.635mm
1" x 1" x 1.0 mm
10 x 10 x 0.5mm
Or others


0.635mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm


Fine ground, Single side polished or Both side polished

Surface Roughness(Ra): 0.2um~0.7um, (Can reach Ra<100A)


Alumina ceramic substrate has lots of advantages, it has good thermal conductivity, stable insulation, thermal shock resistance, wear resistance, Anti-acid and Anti-alkali etc. Can be used in thick film hybrid integrated circuits HTC, LED ceramic heat sink, power modules, semiconductor devices and other fields. Commonly used ceramic substrates are Al2O3, AlN, SiC, BeO, BN, ZrO2 and glass ceramics. Although the thermal conductivity of Al2O3 ceramic substrate is not high (20W/m.K), it is the most widely used ceramic substrate because of its relatively simple production process, low cost and low price.



1) Thick film hybrid integrated circuit (HIC), mainly used in automotive and communication thick film circuits (communication, automotive).
2) Mold stamping sheet: It is mainly used for substrate for crystal oscillator, potentiometer, refrigerator and various types of shaped substrates, military and medical substrates, 
3) Laser perforated sheet
4) Substrate for printer and semiconductor equipment: The largest size printer substrate we can provide is 380mm*100mm and the thickness is between 0.38-1.2.


96% alumina ceramic substrate has better wear resistance, insulation at normal temperature and high temperature, thermal shock resistance, chemical resistance .
99.6% alumina ceramic substrate has a higher thermal conductivity(about 28W/m·K) than 96% purity, can be used as a high-performance heat sink substrate.
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