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Al2O3 ceramic substrate/plate

Al2O3 ceramic substrate/plate

Click here for:  Sapphire(Al2O3) single crystal substrate
 

The main performance parameters

Substrate material

Alumina ceramic plate/substrate

Purity

Alumina(Al2O3) 96%, 99% and 99.7%

Density (g/cm3)

>3.75

Thermal conductivity (w/m.k)

>24

Thermal expansion (x10 -6 / ℃)

6.5~7.5(20~300℃)
6.5~8.0(300~800℃)

Dielectric Strength (Kv/mm)

>17

Dielectric Constant (at 1MHZ)

9~10

Loss tangent (x10 -4 @1MHZ)

4

Flexural strength (N/mm2 )

>350 Mpa

Water absorption

 0 %

Other options

Silicon Nitride(Si3N4) ceramicZirconia(YSZ) ceramic, Aluminum Nitride(AlN) ceramic

 

Standard specifications
Product Name Purity / Method Size Thickness Polishing  
Alumina Ceramic substrate 96%
99%
99.7%
114.3 x 114.3mm
101.6 x 101.6mm
100 x 100mm
76.2 x 76.2mm
50 x 50mm
10 x 10mm
φ50.8mm
φ100mm
Or others
0.1mm
0.25mm
0.385mm
0.5mm
0.635mm
1.0mm
2.0mm
Or others
Un-polished surface
Single side polished
Double side polished
 
Unpolished: Ra 0.2~0.75um
Polished:    Ra 0.02~0.05um
Best Polished: Ra  <10 nm
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Alumina ceramic substrate has lots of advantages, it has good thermal conductivity, stable insulation, thermal shock resistance, wear resistance, Anti-acid and Anti-alkali etc. Can be used in thick film hybrid integrated circuits HTC, LED ceramic heat sink, power modules, semiconductor devices and other fields. Commonly used ceramic substrates are Al2O3, AlN, SiC, BeO, BN, ZrO2 and glass ceramics. Although the thermal conductivity of Al2O3 ceramic substrate is not high (20W/m.K), it is the most widely used ceramic substrate because of its relatively simple production process, low cost and low price.

 

Application:

1) Thick film hybrid integrated circuit (HIC), mainly used in automotive and communication thick film circuits (communication, automotive).
2) Mold stamping sheet: It is mainly used for substrate for crystal oscillator, potentiometer, refrigerator and various types of shaped substrates, military and medical substrates, 
3) Laser perforated sheet
4) Substrate for printer and semiconductor equipment: The largest size printer substrate we can provide is 380mm*100mm and the thickness is between 0.38-1.2.

 

96% alumina ceramic substrate has better wear resistance, insulation at normal temperature and high temperature, thermal shock resistance, chemical resistance .
 
99.6% alumina ceramic substrate has a higher thermal conductivity(about 28W/m·K) than 96% purity, can be used as a high-performance heat sink substrate.
 
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